Semiconductor devices. Mechanical and climatic test methods - High temperature operating life1 Scope This test is used to determine the effects of bias conditions and temperature on solid state devices over time. It simulates the device operating condition in an accelerated way, and is primarily used for device qualification and reliability monitoring. A form of high temperature bias life using a short duration, popularly known as burn in, may be used to screen for infant mortality related failures. The detailed use and application of burn in

engineering and quality requirements anodizing of aluminium and aluminium wrought alloys

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or explicitly stated to have been left intentionally undefined

the test portion is diluted

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Test portion

whenever the heating of materials is one of the functions of the equipment

surface conditions

maintenance periods and dismantling

evaluation of conformity and documentation of test results

minimum requirements for characteristics directly related to the reproducing quality

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