Semiconductor devices. Micro-electromechanical devices - Test method of bonding strength between PDMS and glassWhat is BS EN 62047 15 Bonding strength between PDMS and glass about? BS EN 62047 15 is the 15th part of a multi series standard used for semiconductor devices. BS EN 62047 15 describes the test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone based rubber, PDMS, is used for the building of chip based microfluidic devices fabricated using lithography and replica moulding processes. The problem of bonding strength

This document specifies the method for compaction of cylindrical specimens of bituminous mixtures using a gyratory compactor

This document specifies a test method for determining the resistance to elevated temperature cycling of thermoplastics piping systems for non-pressure applications

in collaboration with technical committee PH/5 Personal Fall Protection

IT companies who use data storage devices

BS 7044-4 on specifications for surfaces for multi-sports use is useful for:

glow-wire -20-3 -9 test 20c           Part 21: R

Specify how to estimate the implementation cost or conduct financial analysis for recommendations developed during the assessment

Ship to shore or quay cranes

The digestion is carried out at relatively low temperatures which allow Hg

This Part of BS 721 specifies the requirements for worm gearing based on axial modules

3 Key elements of the plan

NOTE 4 Industrial type machines complying with the IEC 60034 series may be suitable for certain auxiliary applications